
AI is transforming the world — but behind the scenes, it faces a massive challenge: heat. In this episode of the Prof Mahesh Podcast, we sit down with Prof. Bahgat Sammakia, Vice President of Research at Binghamton University and Founding Director of the Small Scale Systems Integration and Packaging Center, to uncover how mechanical engineers are solving the toughest thermal management challenges in AI and high-performance electronics.From two-phase and microchannel cooling to cross-disciplinary collaboration between mechanical, thermal, electrical, and manufacturing engineers, Prof. Sammakia explains why managing heat is the key to making AI scalable, efficient, and sustainable.We also discuss why engineering fundamentals still matter in the age of automation, and how young engineers can future-proof their careers by being curious, collaborative, and cross-disciplinary.Perfect for students, researchers, and engineers driving the future of AI, semiconductors, and electronics innovation.

Prof. Bahgat Sammakia, SUNY Prof, expert in electronics packaging & energy-smart systems.